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                中文|ENG
                R329

                AI語音專用芯

                產品

                芯片框圖

                R329

                基本規格

                CPU

                ? Dual-core ARM Cortex?-A53@1.5GHz
                ? 32KB L1 I-cache + 32KB L1 D-cache per core
                ? 256KB L2 cache

                DSP

                ? Dual-core HiFi4@400MHz
                ? 32KB L1 I-cache + 32KB L1 D-cache per core
                ? 2MB SRAM

                NPU

                ? Arm China Zhouyi Z1 AIPU, 1TEC+128mac FF
                ? 0.25TOPS@800MHz

                OS

                ? Linux 4.9

                Process

                ? 28nm HPC+

                Memory

                ? Embedded DDR3 128MB
                ? Supports SPI Nand/Nor/eMMC

                Audio

                ? Supports 5 audio ADC and 2 audio DAC
                ? Supports 5 analog audio inputs and 2 analog audio output
                ? Up to 3 I2S/PCM controllers for Bluetooth and external audio codec
                ? Integrated digital microphone, supports maximum 8 digital microphones

                Security Engine

                ? Supports Symmetrical algorithm: AES, DES, 3DES
                ? Supports Hash algorithm: MD5, SHA, HMAC
                ? Supports Pubic Key algorithm: RSA
                ? Supports 160-bit hardware PRNG with 175-bit seed
                ? Supports 256-bit hardware TRNG
                ? Supports 1K-bit EFUSE for chip ID and security application

                Connectivity

                ? USB 2.0 OTG x 1, USB HOST x 1
                ? SDIO 3.0 x 2
                ? LEDC, PWM x 15
                ? IR TX, IR RX
                ? TWI x 3, SPI x 2, UART x 5
                ? LRADC , GPADC x 4
                ? GMAC, SCR

                WIFI&BT

                ? XR829 or others

                Package

                ? BGA231 12mm x 12mm

                方案亮點

                雙核ARM Cortex?-53 架構
                雙核ARM Cortex?-53 架構
                AI語音專@ 用運算單元:Zhouyi AIPU, HiFi4 DSP
                AI語音專用味道運算單元:Zhouyi AIPU, HiFi4 DSP
                三級低功耗喚醒模型
                三級低功耗喚醒模型
                高集成外設設計:5 x ADC、2 x DAC、8 x DMIC
                高集成外設設計:5 x ADC、2 x DAC、8 x DMIC
                28nm工藝,BGA 12mm x 12mm封裝
                28nm工藝,BGA 12mm x 12mm封裝
                工規質量速度力量都得到增加保障
                工規質量保障

                典型機型

                R329

                相關新聞

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